composition
volatiles, 50-80%
Quality Level
bp
100 °C (lit.), 100 °C/1 atm
solubility
H2O: miscible
density
1.2924 g/mL at 25 °C (lit.)
SMILES string
[K+].[I-]
InChI
1S/HI.K/h1H;/q;+1/p-1
InChI key
NLKNQRATVPKPDG-UHFFFAOYSA-M
General description
金蚀刻剂是由碘化钾和碘组成的络合剂,通过电化学氧化金合成。
蚀刻容易控制,底切最小。室温下运行。无氰标准应用。25℃时腐蚀速率为 28 埃/秒。
Application
金蚀刻剂是选择性通用金蚀刻剂,可与负性和正性光致抗蚀剂相容。用于蚀刻金(Au)电极,随后用扫描电子显微镜(SEM)成像,进行形态学研究,也用于金属层,制备纳米电极阵列。 金蚀刻剂还可用于金属辅助化学蚀刻(MACE),制造基于p-n结结构硅纳米柱的太阳能电池。
signalword
Danger
target_organs
Thyroid
存储类别
6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects
ppe
Eyeshields, Faceshields, Gloves, multi-purpose combination respirator cartridge (US)
hcodes
Hazard Classifications
Eye Irrit. 2 - Repr. 1B - STOT RE 2
实验方案
Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.
相关内容
Technical Bulletins
A two-step annealing process for enhancing the ferroelectric properties of poly (vinylidene fluoride)(PVDF) devices.
Park H, et al.
Journal of Material Chemistry C, 3(10), 2366-2370 (2015)
Cyanide-and thiourea-free electrochemical etching of gold for microelectronics applications.
Hu Z and Ritzdorf T
Journal of the Electrochemical Society, 154(10), D543-D549 (2007)
High performance nanopillars array silicon solar cells.
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 117(10), 1-5 (2013)
全球贸易项目编号
| 货号 | GTIN |
|---|---|
| 651818-500ML | 04061832732640 |
| 651818-2.5L | 04065274193533 |

